Hāʻawi ʻo Fumax Tech i nā Papa Kaapuni Paʻi kiʻekiʻe (PCB) me ka PCB multi-layer (paʻi kaapuni papa), HDI kiʻekiʻe (high density inter-connector), arbitrary-layer PCB a me nā PCB hiki ke hoʻololi ʻia… etc.
Ma ke ʻano he kumu kumu, ʻike ʻo Fumax i ke koʻikoʻi o ka maikaʻi hilinaʻi o ka PCB.Hoʻokomo mākou i nā mea hana maikaʻi loa a me nā hui akamai e hana i nā papa maikaʻi loa.
Aia ma lalo nā ʻāpana PCB maʻamau.
PCB paakiki
ʻO nā PCB Flexible a ʻoʻoleʻa
HDI PCB
PCB kiʻekiʻe
Kiʻekiʻe TG PCB
LED PCB
PCB kumu metala
Mānoanoa Cooper PCB
Aluminum PCB
Hōʻike ʻia kā mākou hana hana ma ka pakuhi ma lalo nei.
| ʻAno | Ka hiki |
| ʻĀpana | ʻO nā ʻāpana he nui (4-28) 、HDI (4-20) Flex, Rigid Flex |
| ʻaoʻao ʻelua | CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm) |
| ʻO nā ʻāpana he nui | 4-28 papa, ka mānoanoa o ka papa 8mil-126mil （0.2mm-3.2mm） |
| Kanu/makapo Via | 4-20 papa, ka mānoanoa o ka papa 10mil-126mil（0.25mm-3.2mm） |
| HDI | 1+N+1,2+N+2,3+N+3, Kekahi papa |
| Flex & Rigid-Flex PCB | 1-8 mau ʻāpana Flex PCB , 2-12 mau ʻāpana ʻoʻoleʻa PCB HDI + ʻoʻoleʻa PCB |
| Laminate |
|
| ʻAno Soldermask (LPI) | Taiyo, Goo's, Probimer FPC ..... |
| Peelable Soldermask |
|
| Inika kalapona |
|
| HASL/Alakai manuahi HASL | Mānoanoa: 0.5-40um |
| OSP |
|
| ENIG (Ni-Au) |
|
| Electro-bondable Ni-Au |
|
| Electro-nickel palladium Ni-Au | Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm |
| Elele.Gula paakiki |
|
| tini manoanoa |
|
| Ka hiki | Nuipa? iecaianoaaiiuo |
| Min | 0.20mm |
| Min.Hole Drill Laser | 4mil (0.100mm) |
| Laina Laulā/Spacing | 2mil/2mil |
| Max.Nui o ka Panel | 21.5" X 24.5" (546mm X 622mm) |
| Laina Laulā/Spacing tolerance | Non electro coating:+/-5um，Electro coating:+/-10um |
| PTH Hole Hoomanawanui | +/-0.002 iniha(0.050mm) |
| NPTH Hole Hoʻomanawanui | +/-0.002 iniha(0.050mm) |
| Hole Wahi Hoomanawanui | +/-0.002 iniha(0.050mm) |
| Hole to Edge Tolerance | +/-0.004 iniha(0.100mm) |
| ʻO ka hoʻomanawanui ʻo Edge to Edge | +/-0.004 iniha(0.100mm) |
| Layer to Layer Tolerance | +/-0.003 iniha(0.075mm) |
| Hoʻomanawanui impedance | +/- 10% |
| Warpage % | Max≤0.5% |
ʻenehana (Huahana HDI)
| MEA | Hana ʻia |
| Laser Via Drill/Pad | 0.125/0.30, 0.125/0.38 |
| Makapō Via Drill/Pad | 0.25/0.50 |
| Laina Laulā/Spacing | 0.10/0.10 |
| Hoʻohālua | CO2 Laser Direct Drill |
| Mea Hana Hana | FR4 LDP(LDD);RCC 50 ~ 100 micron |
| Ka Mānoanoa Cu ma ka pā Hole | Puka makapō: 10um (min) |
| ʻAspect Ratio | 0.8 : 1 |
ʻenehana (PCB hikiwawe)
| Papahana | Hiki |
| ʻOlo i ka ʻōwili (hoʻokahi ʻaoʻao) | AE |
| ʻOlo i ka ʻōwili (pālua) | NO |
| ʻO ka leo i ka ʻōwili mea ākea mm | 250 |
| Nui hana liʻiliʻi mm | 250x250 |
| Ka nui hana nui mm | 500x500 |
| SMT Assembly patch (ʻAe/ʻAʻole) | AE |
| Hiki iā Air Gap (ʻAe/ʻAʻole) | AE |
| Ka hana ʻana o ka pā paʻa paʻa a palupalu (ʻAe/ʻAʻole) | AE |
| Nā papa kiʻekiʻe (paʻakikī) | 10 |
| ʻO ka papa kiʻekiʻe loa (Pāpala palupalu) | 6 |
| ʻepekema Material |
|
| PI | AE |
| PET | AE |
| keleawe electrolytic | AE |
| Poʻi keleawe Anneal i ʻōwili ʻia | AE |
| PI |
|
| Uhi kiʻiʻoniʻoni alignment tolerance mm | ±0.1 |
| Kiʻiʻoniʻoni uhi liʻiliʻi mm | 0.175 |
| Hoʻoikaika |
|
| PI | AE |
| FR-4 | AE |
| LAKOU | AE |
| PILI EMI |
|
| Inika kala | AE |
| Kiʻiʻoniʻoni kālā | AE |