E PCB - Shenzhen Fumax Technology Co., Ltd.
micro chip scanning

Hāʻawi ʻo Fumax Tech i nā Papa Kaapuni Paʻi kiʻekiʻe (PCB) me ka PCB multi-layer (paʻi kaapuni papa), HDI kiʻekiʻe (high density inter-connector), arbitrary-layer PCB a me nā PCB hiki ke hoʻololi ʻia… etc.

Ma ke ʻano he kumu kumu, ʻike ʻo Fumax i ke koʻikoʻi o ka maikaʻi hilinaʻi o ka PCB.Hoʻokomo mākou i nā mea hana maikaʻi loa a me nā hui akamai e hana i nā papa maikaʻi loa.

Aia ma lalo nā ʻāpana PCB maʻamau.

PCB paakiki

ʻO nā PCB Flexible a ʻoʻoleʻa

HDI PCB

PCB kiʻekiʻe

Kiʻekiʻe TG PCB

LED PCB

PCB kumu metala

Mānoanoa Cooper PCB

Aluminum PCB

 

Hōʻike ʻia kā mākou hana hana ma ka pakuhi ma lalo nei.

ʻAno

Ka hiki

ʻĀpana

ʻO nā ʻāpana he nui (4-28) 、HDI (4-20) Flex, Rigid Flex

ʻaoʻao ʻelua

CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)

ʻO nā ʻāpana he nui

4-28 papa, ka mānoanoa o ka papa 8mil-126mil (0.2mm-3.2mm)

Kanu/makapo Via

4-20 papa, ka mānoanoa o ka papa 10mil-126mil(0.25mm-3.2mm)

HDI

1+N+1,2+N+2,3+N+3, Kekahi papa

Flex & Rigid-Flex PCB

1-8 mau ʻāpana Flex PCB , 2-12 mau ʻāpana ʻoʻoleʻa PCB HDI + ʻoʻoleʻa PCB

Laminate

 

ʻAno Soldermask (LPI)

Taiyo, Goo's, Probimer FPC .....

Peelable Soldermask

 

Inika kalapona

 

HASL/Alakai manuahi HASL

Mānoanoa: 0.5-40um

OSP

 

ENIG (Ni-Au)

 

Electro-bondable Ni-Au

 

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm

Elele.Gula paakiki

 

tini manoanoa

 

Ka hiki

Nuipa? iecaianoaaiiuo

Min

0.20mm

Min.Hole Drill Laser

4mil (0.100mm)

Laina Laulā/Spacing

2mil/2mil

Max.Nui o ka Panel

21.5" X 24.5" (546mm X 622mm)

Laina Laulā/Spacing tolerance

Non electro coating:+/-5um,Electro coating:+/-10um

PTH Hole Hoomanawanui

+/-0.002 iniha(0.050mm)

NPTH Hole Hoʻomanawanui

+/-0.002 iniha(0.050mm)

Hole Wahi Hoomanawanui

+/-0.002 iniha(0.050mm)

Hole to Edge Tolerance

+/-0.004 iniha(0.100mm)

ʻO ka hoʻomanawanui ʻo Edge to Edge

+/-0.004 iniha(0.100mm)

Layer to Layer Tolerance

+/-0.003 iniha(0.075mm)

Hoʻomanawanui impedance

+/- 10%

Warpage %

Max≤0.5%

ʻenehana (Huahana HDI)

MEA

Hana ʻia

Laser Via Drill/Pad

0.125/0.30, 0.125/0.38

Makapō Via Drill/Pad

0.25/0.50

Laina Laulā/Spacing

0.10/0.10

Hoʻohālua

CO2 Laser Direct Drill

Mea Hana Hana

FR4 LDP(LDD);RCC 50 ~ 100 micron

Ka Mānoanoa Cu ma ka pā Hole

Puka makapō: 10um (min)

ʻAspect Ratio

0.8 : 1

ʻenehana (PCB hikiwawe)

Papahana

Hiki

ʻOlo i ka ʻōwili (hoʻokahi ʻaoʻao)

AE

ʻOlo i ka ʻōwili (pālua)

NO

ʻO ka leo i ka ʻōwili mea ākea mm

250

Nui hana liʻiliʻi mm

250x250

Ka nui hana nui mm

500x500

SMT Assembly patch (ʻAe/ʻAʻole)

AE

Hiki iā Air Gap (ʻAe/ʻAʻole)

AE

Ka hana ʻana o ka pā paʻa paʻa a palupalu (ʻAe/ʻAʻole)

AE

Nā papa kiʻekiʻe (paʻakikī)

10

ʻO ka papa kiʻekiʻe loa (Pāpala palupalu)

6

ʻepekema Material 

 

PI

AE

PET

AE

keleawe electrolytic

AE

Poʻi keleawe Anneal i ʻōwili ʻia

AE

PI

 

Uhi kiʻiʻoniʻoni alignment tolerance mm

±0.1

Kiʻiʻoniʻoni uhi liʻiliʻi mm

0.175

Hoʻoikaika 

 

PI

AE

FR-4

AE

LAKOU

AE

PILI EMI

 

Inika kala

AE

Kiʻiʻoniʻoni kālā

AE