E ʻO nā PCB Flexible & Rigid Flex - Shenzhen Fumax Technology Co., Ltd.

ʻO nā PCB Flexible a ʻoʻoleʻa

Fumax -- Ka hana ʻaelike o nā PCB hikiwawe, nā PCB Semiflexible, nā PCB hiki ke paʻa, nā PCB hikiwawe ma ka Aluminium.Ma ke ʻano he mea hana o Flexible & Rigid Flex PCBs, hiki iā Fumax ke hāʻawi i ka lawelawe wikiwiki / prototype wikiwiki a me ka lawelawe hana nui no nā mea kūʻai aku ma ka honua holoʻokoʻa.

PCBs

ʻO ka laulā huahana o Flexible & Rigid Flex PCBs hiki iā Fumax ke hāʻawi:

Nā PCB hikiwawe

Nā hiʻohiʻona -- Nā papa kaapuni paʻi maʻalahi e pili ana i ka polyimide, mai ka ʻaoʻao hoʻokahi a hiki i ka flex multilayer.Māmā a lahilahi, e kōkua ana i ka hōʻemi ʻana i ka nui a me ke kaumaha o nā huahana uila.Kiʻekiʻe wiring density, manuahi ʻole, wili, a me ka pelu ʻana, kiʻekiʻe ka maʻalahi, ka hoʻopau wela maikaʻi a me ka solderability me ka heluna SMD a underfill.

Māmā -- ʻAno Mea(PI/LCP/PTFE);Layer(1-10);Mānoanoa o ka Huahana Hoʻopau (0.1-0.8mm);Ana o ka Huahana Hoʻopau (9*22 iniha);ʻO ka liʻiliʻi liʻiliʻi liʻiliʻi liʻiliʻi (3-6 manawa ka mānoanoa o ka papa);Laina Laulā/Lua(2.5/2.5mil);Pono Pono (± 0.05mm).

 

Nā PCB Semiflexible

Nā hiʻohiʻona -- Nā mea FR4 lahilahi, ʻaoʻao ʻelua.ʻO ka lōʻihi o ʻelima mau pōʻaiapili kūlou me kahi radius kulou 5mm.ʻO nā hāʻina hiki ke hoʻokomo pono i ke kumu kūʻai.Hoʻopili ʻia me ka hoʻomoʻa ʻole ʻana.ʻOi aku ka paʻa o ke kūkulu ʻana, hoʻomaʻamaʻa i ka lawelawe ʻana i ka wā e hui ai.

Māmā -- Mea (FR4 (125µm Dielectric));Layer(2 Layer PTH);Mānoanoa o ka Huahana Hoʻopau (0.15 mm - 0.18 mm);Mānoanoa keleawe(18µm / 35µm / 70µm);Min.Laina / Spacing(50µm / 50µm);Max.Nui PCB(580 mm x 500 mm);ʻO ka wili liʻiliʻi loa(0.2 mm).

 

ʻO nā PCB hiki ke paʻa

Nā hiʻohiʻona -- Kūʻē kūʻokoʻa a me ke kūpaʻa kūʻokoʻa.Hoemi Kaumaha.ʻO ka hilinaʻi kiʻekiʻe a me ka 3D Mounting.ʻO nā papa kaapuni i paʻi ʻia me nā wahi paʻa a me nā wahi maʻalahi me nā helu hoʻemi o nā papa.ʻO ka hui pū ʻana o ka polyimide a me FR4, a i ʻole FR4 a me ka laminate lahilahi.ʻO nā papa kaapuni paʻi paʻi ʻoʻoleʻa e hoʻohui i nā papa ʻoʻoleʻa me ka pono ʻole o nā kaula a i ʻole nā ​​mea hoʻohui, e hopena i ka hoʻouna ʻana i ka hōʻailona ʻoi aku ka maikaʻi.Me ka heluna kanaka SMD a underfill.Loaʻa nā ʻili āpau i hoʻohana ʻia.

Māmā -- Hoʻonohonoho (Multilayer Flexible Paging a i ʻole Hoʻohui Paʻa ʻana/HDI Structure);Layer(2-20);Ka laula o ka palena liʻiliʻi liʻiliʻi (3mm);Laina Laulā/Luna(Iloko:3/3mil,waho:3.5/3.5mil);ʻO ke anawaena wili liʻiliʻi loa(0.10mm(ka wili mīkini), 0.15mm (ka wili laser));Ka laulā apo liʻiliʻi loa(4mil);Spacing Between Hole abd Conductor(Layer≤6:5mil, 7≤Layer≤11:6mil, Layer≥12:8mil);ʻO ka mānoanoa o ka pā a me ka ratio Aperture(1:1(Blind Via);16:1(Ma o Via));Ka pololei o ka ana (± 0.1mm(special ± 0.05mm));Ke Kaʻina Hana Ili(ENIG/ENEPIG/HASL/FLASH GOLD/HARD GOLD/OSP).

 

Nā PCB maʻalahi ma ka Aluminum

Nā hiʻohiʻona -- Aluminum a i ʻole keleawe keleawe.Loaʻa me nā mea hoʻopaʻa thermally conductive a i ʻole prepreg (0.3-3.0 W/(m•K)).Loaʻa ma ka punched version, a i ʻole routed.

Māmā -- Mea (Polyimide);Layer(Hoʻokahi ʻaoʻao - 3 Layer);Mānoanoa o ka Huahana Hoʻopau (50µm - 1200µm (me ka Stiffner));Mānoanoa keleawe(9µm / 12µm / 18µm / 35µm);Min.Laina / Manawa(65µm / 65µm (LDI));Nā ʻili (OSP/ Immersion Tin / Immersion Ni / Au / Plated Ni/Au);ʻO ka wili liʻiliʻi loa(0.2 mm).

FPC
TP
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Nā noi:

* Lapaʻau - Lapaʻau diagnostic, uila uila a me nā mea hana kiʻi lāʻau.
* Telecommunications PCBTelecommunications - ʻO nā mea lawe chip alapine kiʻekiʻe a me nā huahana kamaʻilio fiber-optic.
* ʻOihana a me ka ʻoihana PCBIindustrial & Commercial - Robotics, mea uila uila a me nā noi kukui LED.
* Kaʻa a me ka Automotive PCBAutomotive - Nā modula kamera, kukui a me nā mea uila ʻē aʻe.

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